Semiconductor Industry
7105102000
Introduction
Due to its high hardness, good thermal conductivity and chemical stability, agglomerated diamond micropowder is widely used in the grinding and polishing process of semiconductor devices, especially in the processing of semiconductor wafers, such as sapphire wafers, silicon carbide wafers and so on. The fine particle structure of agglomerated diamond powders enables efficient removal of impurities from the wafer surface and enhances the finish, thus improving the performance and reliability of the devices.
Properties
| Color | Gray/White/Yellow |
| Shape | Powdery |
| Material | Synthetic Diamond |
| Purity | 99.9% |
Advantages | 1. High intensity and powerful grinding force. 2. Regular crystalls with uniform particle distribution. 3. Extremely low impurity content. |
Application of Agglomeration Diamond Micro Powder in Semiconductor
1. Chemical Mechanical Polishing (CMP): Diamond micropowders are widely used in the semiconductor industry for the chemical mechanical polishing process. In the manufacture of semiconductor chips, CMP is an important process for flattening the surface and removing uneven layers.
2. Wafer Dicing: Diamond micropowders are also used to make dicing tools for cutting silicon wafers or other materials. These tools need to have high hardness and wear resistance to ensure accurate and efficient cutting.
3. Thermal Conductivity Material: Diamond micropowder is used as a high thermal conductivity material in semiconductor devices. In some applications where heat dissipation is required, diamond micropowder can be used as a filler material to help improve the thermal efficiency of the device.
4. Diamond Films: Diamond micropowders can also be used to prepare diamond films, which can be used as protective, thermally conductive or other special functional layers in semiconductor devices.
Welcome to inquiry.
Introduction
Due to its high hardness, good thermal conductivity and chemical stability, agglomerated diamond micropowder is widely used in the grinding and polishing process of semiconductor devices, especially in the processing of semiconductor wafers, such as sapphire wafers, silicon carbide wafers and so on. The fine particle structure of agglomerated diamond powders enables efficient removal of impurities from the wafer surface and enhances the finish, thus improving the performance and reliability of the devices.
Properties
| Color | Gray/White/Yellow |
| Shape | Powdery |
| Material | Synthetic Diamond |
| Purity | 99.9% |
Advantages | 1. High intensity and powerful grinding force. 2. Regular crystalls with uniform particle distribution. 3. Extremely low impurity content. |
Application of Agglomeration Diamond Micro Powder in Semiconductor
1. Chemical Mechanical Polishing (CMP): Diamond micropowders are widely used in the semiconductor industry for the chemical mechanical polishing process. In the manufacture of semiconductor chips, CMP is an important process for flattening the surface and removing uneven layers.
2. Wafer Dicing: Diamond micropowders are also used to make dicing tools for cutting silicon wafers or other materials. These tools need to have high hardness and wear resistance to ensure accurate and efficient cutting.
3. Thermal Conductivity Material: Diamond micropowder is used as a high thermal conductivity material in semiconductor devices. In some applications where heat dissipation is required, diamond micropowder can be used as a filler material to help improve the thermal efficiency of the device.
4. Diamond Films: Diamond micropowders can also be used to prepare diamond films, which can be used as protective, thermally conductive or other special functional layers in semiconductor devices.
Welcome to inquiry.
